The Future of Quantum Information: Challenges and Vision


Dohyun Kim, Jungho Kang, Tae Woo Kim, Yi Pan, Jong Hyuk Park, Journal of Information Processing Systems Vol. 17, No. 1, pp. 151-162, Feb. 2021  

https://doi.org/10.3745/JIPS.01.0063
Keywords: Quantum Information, Quantum, Sensing, Computing, Communication
Fulltext:

Abstract

Quantum information has passed the theoretical research period and has entered the realization step for its application to the information and communications technology (ICT) sector. Currently, quantum information has the advantage of being safer and faster than conventional digital computers. Thus, a lot of research is being done. The amount of big data that one needs to deal with is expected to grow exponentially. It is also a new business model that can change the landscape of the existing computing. Just as the IT sector has faced many challenges in the past, we need to be prepared for change brought about by Quantum. We would like to look at studies on quantum communication, quantum sensing, and quantum computing based on quantum information and see the technology levels of each country and company. Based on this, we present the vision and challenge for quantum information in the future. Our work is significant since the time for first-time study challengers is reduced by discussing the fundamentals of quantum information and summarizing the current situation.


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Cite this article
[APA Style]
Kim, D., Kang, J., Kim, T., Pan, Y., & Park, J. (2021). The Future of Quantum Information: Challenges and Vision. Journal of Information Processing Systems, 17(1), 151-162. DOI: 10.3745/JIPS.01.0063.

[IEEE Style]
D. Kim, J. Kang, T. W. Kim, Y. Pan, J. H. Park, "The Future of Quantum Information: Challenges and Vision," Journal of Information Processing Systems, vol. 17, no. 1, pp. 151-162, 2021. DOI: 10.3745/JIPS.01.0063.

[ACM Style]
Dohyun Kim, Jungho Kang, Tae Woo Kim, Yi Pan, and Jong Hyuk Park. 2021. The Future of Quantum Information: Challenges and Vision. Journal of Information Processing Systems, 17, 1, (2021), 151-162. DOI: 10.3745/JIPS.01.0063.