Fault Detection in the Semiconductor Etch Process Using the Seasonal Autoregressive Integrated Moving Average Modeling
Muhammad Zeeshan Arshad, Javeria Muhammad Nawaz, Sang Jeen Hong, Journal of Information Processing Systems Vol. 10, No. 3, pp. 429-442, Sep. 2014
https://doi.org/10.3745/JIPS.04.0004
Keywords: Autoregressive Integrated Moving Average, Dynamic Time Warping, Fault Detection, Seasonal Autoregressive Integrated Moving Average, Semiconductor Process, Time Series Modeling
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Cite this article
[APA Style]
Arshad, M., Nawaz, J., & Hong, S. (2014). Fault Detection in the Semiconductor Etch Process Using the Seasonal Autoregressive Integrated Moving Average Modeling. Journal of Information Processing Systems, 10(3), 429-442. DOI: 10.3745/JIPS.04.0004.
[IEEE Style]
M. Z. Arshad, J. M. Nawaz, S. J. Hong, "Fault Detection in the Semiconductor Etch Process Using the Seasonal Autoregressive Integrated Moving Average Modeling," Journal of Information Processing Systems, vol. 10, no. 3, pp. 429-442, 2014. DOI: 10.3745/JIPS.04.0004.
[ACM Style]
Muhammad Zeeshan Arshad, Javeria Muhammad Nawaz, and Sang Jeen Hong. 2014. Fault Detection in the Semiconductor Etch Process Using the Seasonal Autoregressive Integrated Moving Average Modeling. Journal of Information Processing Systems, 10, 3, (2014), 429-442. DOI: 10.3745/JIPS.04.0004.