Patch Integrity Verification Method Using Dual Electronic Signatures
JunHee Kim, Yoojae Won, Journal of Information Processing Systems Vol. 13, No. 6, pp. 1516-1526, Dec. 2017
https://doi.org/10.3745/JIPS.03.0084
Keywords: Digital signature, Electronic Signature, Integrity, Patch Distribution, Patch Management
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Cite this article
[APA Style]
Kim, J. & Won, Y. (2017). Patch Integrity Verification Method Using Dual Electronic Signatures. Journal of Information Processing Systems, 13(6), 1516-1526. DOI: 10.3745/JIPS.03.0084.
[IEEE Style]
J. Kim and Y. Won, "Patch Integrity Verification Method Using Dual Electronic Signatures," Journal of Information Processing Systems, vol. 13, no. 6, pp. 1516-1526, 2017. DOI: 10.3745/JIPS.03.0084.
[ACM Style]
JunHee Kim and Yoojae Won. 2017. Patch Integrity Verification Method Using Dual Electronic Signatures. Journal of Information Processing Systems, 13, 6, (2017), 1516-1526. DOI: 10.3745/JIPS.03.0084.