High Shock-Resistant Design of Piezoresistive High-g Accelerometer


Yongle Lu, Zhen Qu, Jie Yang, Wenxin Wang, Wenbo Wang, and Yu Liu, Journal of Information Processing Systems Vol. 19, No. 2, pp. 173-188, Apr. 2023  

10.3745/JIPS.04.0270
Keywords: FEM, High-g Accelerometer, Natural Frequency, Piezoresistive, Transverse Effect
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Abstract

To improve the shock-resistance of piezoresistive high-g accelerometer, we propose a design of piezoresistive high-g accelerometer. The accelerometer employs special-shaped proof masses system with a cross gap. Four tiny sensing beams are bonded above the cross gap. The expression of the deformation, natural frequency and damping is deduced, and the structural parameters are optimized. The accelerometer structure is simulated and verified by finite element method (FEM) simulation. The results show that the range of the accelerometer can reach 200,000 g, the natural frequency is 453.6 kHz, and the cross-axis sensitivity of X-axis and Y-axis is 0.25% and 0.11%, respectively, which can apply to the measurement of high shock. Contrastively, the crossaxis sensitivity of X-axis and Y-axis is respectively, reduced by 93.2% and 96.9%. The sensitivity of our accelerometer is 0.88 μV/g. It is of great value for the application of piezoresistive high-g accelerometer with high shock-resistance.


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Cite this article
[APA Style]
Yongle Lu, Zhen Qu, Jie Yang, Wenxin Wang, Wenbo Wang, & and Yu Liu (2023). High Shock-Resistant Design of Piezoresistive High-g Accelerometer. Journal of Information Processing Systems, 19(2), 173-188. DOI: 10.3745/JIPS.04.0270.

[IEEE Style]
Y. Lu, Z. Qu, J. Yang, W. Wang, W. Wang and a. Y. Liu, "High Shock-Resistant Design of Piezoresistive High-g Accelerometer," Journal of Information Processing Systems, vol. 19, no. 2, pp. 173-188, 2023. DOI: 10.3745/JIPS.04.0270.

[ACM Style]
Yongle Lu, Zhen Qu, Jie Yang, Wenxin Wang, Wenbo Wang, and and Yu Liu. 2023. High Shock-Resistant Design of Piezoresistive High-g Accelerometer. Journal of Information Processing Systems, 19, 2, (2023), 173-188. DOI: 10.3745/JIPS.04.0270.